That is not to say that there aren’t any downsides, but this strategy may result in a noticeable gap between the performance of Android’s main competitor, Apple’s A18 Pro, and, from here, Dimensity 9400 and Snapdragon 8 Gen 4. READ MORE: Snapdragon 8 Gen 4 May Break the 4GHz Barrier, Thanks to TSMC’s N3E Process and Custom Nuvia Cores ➜ Insider Digital Chat Station has revealed that the Dimensity 9400 will come with two clusters of big-cores: 1x Cortex-X5 and 3x Cortex-X4 cores. The upside of this is that early engineering samples for the MediaTek Dimensity were able to hit 10,000 on Geekbench 6 multi-core, which is well within the territory of Qualcomm’s Gen 4 flagship chipset, that uses custom Oryon cores. One of the more important details for these SoCs is that their efficiency numbers remain hidden for now. The Qualcomm Snapdragon 8 Gen 4 was reported to have been reaching upwards of 14W of TDP, which is a significant jump from 12.1W last year. With no E-cores and an overall combination of power hungry large cores, there will be discussions regarding the potential implications to battery and performance under sustained load. Regardless, Dimensity utilizes Cortex off-the-shelf cores, which means that it will be interesting to see how MediaTek and, consequently, the manufacturers keep the thermals in check. The S24 Ultra, released earlier this year sported a vapor chamber that was almost double in size than its predecessor, so we can expect active cooling to become a major part of flagship smartphones moving forward. This is all we know for now, but rest assured that we will keep you updated as new information becomes available. via: DCS (Weibo)
